在电子/电器和机电制造领域，灌封/封装工艺是指使用特定条件下能够凝固或硬化的高分子聚合物填充的过程。常见和被广泛使用的聚合物有环氧树脂、聚氨酯树脂和有机硅树脂。它们属于热固性树脂，且具有优良的综合性能，包括：高强度、耐热性好、电性能优良、抗腐蚀、耐老化、尺寸稳定性好等等，其中一些还具有导热或导电的功能。

In the field of electronic/electrical and electromechanical manufacturing, potting/encapsulation is the process of filling with polymers that can solidify or harden under certain conditions. Common and widely used polymers are epoxy resins, polyurethane resins, and silicone resins. They are thermosetting resins and have a wide range of properties including high strength, good heat resistance, excellent electrical properties, corrosion resistance, aging resistance, good dimensional stability, etc. Some of them are also thermally or electrically conductive.

选择灌封工艺的最终目的主要有：提高电子电路和机电系统的绝缘等级，运行可靠性，工作寿命和保密等级等等。这一工艺在军工、汽车、航空航天、海洋、电讯、医疗、电力等领域被广泛应用，例如： 

The ultimate goal of the potting process is to improve the properties of electronic circuits and electromechanical systems, including insulation level, operational reliability, working life, confidentiality level, etc. This process is widely used in military, automotive, aerospace, marine, telecommunications, medical, power, and other sectors. Examples:

• 使用树脂浇注封装的电机、电源、变压器和电磁阀，能够在一个宽的温度范围内获得更高的绝缘等级，降低匝间短路和绕组烧毁的概率。

Motors, power supplies, transformers and solenoid valves encapsulated with resin casting enable higher insulation levels over a wide temperature range, reducing the probability of inter-turn short circuits and winding burn-out.

• 被安装在汽车、船舶、铁路机车和航天器上的电子电器零件，通过使用树脂浇注封装后，能够抵抗不利的环境因素造成的影响（湿气、凝露、盐雾、油污等等），还能够避免电路和电子元器件在震动和温度交变中出现损坏。

Electrical and electronic components installed in cars, ships, railway locomotives, and spacecraft are protected from adverse environmental factors (moisture, condensation, salt spray, oil, etc.) through the use of resin encapsulation, which also prevents damage to circuits and electronic components in the event of vibration and temperature fluctuations.

• 使用具有高导热性能的聚合物封装电子电器和机电系统，能够有效的把发热零件的热量导出，从而保证系统能够在更低的温度下持续工作。

The use of highly thermally conductive polymers for the encapsulation of electronic and electro-mechanical systems allows the heat to be removed from the heated parts, thus ensuring that the system can continue to operate at lower temperatures.

• 水下或海底工作的的电子设备，通过使用树脂浇注封装能够在原有的基础上提供第二道防护，提高最终的可工作寿命。

Underwater or subsea electronic equipment can be provided with a second layer of protection on top of the original by using resin encapsulation to increase the final working life.

• 电缆插头座，防止焊点腐蚀或折断，通过使用树脂能够达到固定和保护的需要。

The use of resin can also fixate and protect cable plug holders and prevent corrosion or breakage of solder joints.

汇众电子提供多种不同性能和特点的灌封/封装材料。这些材料由欧美具有悠久历史和实力的制造商研发和生产，能够帮助客户实现不同的目标。此外，还能够根据客户的需求提供定制性的材料：外观颜色、粘度、硬度、凝胶时间、导热性能、电气性能、热性能、力学性能等等。

Wilkon offers a wide range of potting/encapsulation materials with different properties and characteristics. Developed and produced by capable manufacturers with a long history in Europe and North America, these materials are able to help customers achieve different objectives. In addition, Wilkon also provides customized materials to accommodate customers\' needs in color (appearance), viscosity, hardness, gel time, thermal conductivity, electrical properties, thermal properties, mechanical properties, etc.

灌封工艺的选择和施用依赖专业的知识和经验。我们可以意识到，电子电器系统内零件众多，结构复杂，特性不同，应用环境多变等因素，一旦树脂的物理和电气特性与之不兼容，势必会给产品的可靠性带来负面的影响。如何在保证工艺质量的前提下能够实现批量化的快速生产也常常困扰很多不同的用户。汇众电子拥有具备专业背景的技术团队，我们从材料的定型，到测试，到工艺（甚至包括模具设计）的所有环节，能够为不同需求的客户提供全方位技术支援。

The selection and application of the potting process relies on specialist knowledge and experience. We are quite aware that electrical and electronic systems tend to have a lot of parts within, in addition to their complex structures, different features, and various application scenarios. If the physical or electrical properties of the selected resin are not compatible with any of those factors, the product reliability is bound to be compromised. Another challenge faced by many users is the method to guarantee process quality while achieving rapid batch production. For that purpose, Wilkon has a team of technical experts who can provide all-around support for customers’ different needs from material finalization, to testing and process (even mold design).

电路板组件表面防护材料是另一种电子电路的防护增强手段，具有施用简单和低成本的优势。浇注/封装工艺的防护等级更高、耐候性更长、抗冲击能力更高。选择哪种方式对电子产品予以保护，需要充分考虑到产品的应用环境，防护等级，工艺和成本等因素。（这类型的产品可从网站内线路板保护材料板块中查阅）

Surface protection materials for circuit board components provide another means of enhancing the protection of electronic circuits, offering the advantage of simple application and low cost. The potting/encapsulation process offers a higher level of protection, longer weather resistance, and better impact resistance. The choice of protection method for an electronic product depends on the application environment, level of protection required, process, and cost. (These types of products can be found in the Protection Materials for PCBs section of the website)